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Circuit Boards Separated by Laser Depaneling Machine

Product description: Circuit Boards Separated by Laser Depaneling Machine
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Circuit Boards Separated by Laser Depaneling Machine,CWVC-5L

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

Specification

Laser class	1
Max. working area (X x Y x Z)	300 mm x 300 mm x 11 mm
Max. recognition area (X x Y)	300 mm x 300 mm
Max. material size (X x Y)	350 mm x 350 mm
Data input formats	Gerber, X-Gerber, DXF, HPGL,
Max. structuring speed	Depends on application
Positioning accuracy	± 25 μm (1 Mil)
Diameter of focused laser beam	20 μm (0.8 Mil)
Laser wavelength	355 nm
System dimensions (W x H x D)	1000mm940mm 1520 mm
Weight	~ 450 kg (990 lbs)
Operating conditions
Power supply	230 VAC, 50-60 Hz, 3 kVA
Cooling	Air-cooled (internal water-air cooling)
Ambient temperature	22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm (71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
Humidity	< 60 % (non-condensing)
Required accessoires	Exhaust unit